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Yac A912 晶圆处理系统

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Yac A912 晶圆处理系统

Standard Specification

Applicable package QFP, BGA, QFN, SSOP etc.

Package dimensions 5x5 to 31x31 mm

Socket type Clam-shell

(Option: Open-top)

Temperature range A912: Ambient

H912: Ambient, +50 to 150deg.C +/-3deg.C

Output bin 2 BIN

Index time 3.0 sec

Throughput Ambient: 450 UPH

Test site 1ch

Contact pitch Center 1ch

Contact pressure 30 kg

Power supply AC200V, 30A

Air supply 0.4 MPa, 100 L/min

Equipment dimensions W760 x D840 x H700 mm

Weight 150 kg

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